Guangdong Electronic Technology Co., Ltd. at the spring sales of Emerson & Cuming (爱玛森康明) 
 G500 G757 G909 and other products. 

 ECCOBOND G500 is a single component, heat curing epoxy adhesive universal and sealants. It is a low viscosity, easy pumping, is the friction of the paste material, good resistance to collapse, long period of storage at room temperature. Good surface brightness after curing, high temperature, high strength, excellent heat resistance. And dielectric properties of water. For copper and other metal and hard plastic designed for assembly and insulation, but also can be used for lead and coil connections. Industry in the induction coil has a very mature application. Curing conditions: 125C * 60min; 150C * 20min; 175C * 5min. 
 Packing 5kg / tin 
 Brand Emerson Cuming 
 MOQ 1 can 
 Shear strength of 17.1 (MPa) 
 Effective substances ≥ 100 (%) 
 Temperature 180 (℃) 
 Shelf life of 4 (months)