Details: 
 Phase change material thermal conductivity test project test methods for test results 
 RC0032 RC1032 RC2032 RC3032 
 Light gray color black yellow pink visual 
 No no no aluminum foil substrate 
 Heat resistance ℃ in2 / w 0.03 0.05 0.05 0.035 ASTM D5470 
 Thermal conductivity w / m · k 3 0.7 0.7 2.5 ASTM D5470 
 Phase transition temperature ℃ 52 58 58 58 
 Density g/cm2 2.2 1.35 1.3 1.2 
 Total thickness mm 0.09 0.13 0.13 0.13 ASTM D374 
 Storage Temperature ℃ <40 <45 <45 <40 
 Temperature range ℃ -55 ~ 120 -20 ~ 130 -20 ~ 130 -55 ~ 130 
 Storage period (months) 24,121,212 

 Overview 
 Phase change thermal energy reinforced polymer material is designed so that power consumption for electronic devices and connected to the thermal resistance between the heat sink to minimize, the thermal resistance of the channel so that a small heat sink to achieve the best performance and improved microprocessor, memory modules DC / DC converters and power module reliability. 
 Thermal performance of phase change materials is the key characteristics of the phase transition. Material is solid at room temperature and easy to handle, can be used as dry pads, clean and solid pieces or devices used to heat the surface. Device operating temperature is reached, the phase change material soft, add a little step up force, the same material as thermal grease is easy to integrate, and two with the surface. This completely fills the interface gap and the gap between device and heat sink capacity, making the phase change pad is superior to non-current elastomer or graphite-based thermal pad, thermal grease and get similar performance. 
 Thermal phase change material is not conductive, but due to phase change materials, thermal heat sink installed in the usual undergo phase change, there may be metal to metal contact, so the phase change material can not be used as electrical insulation. 
 Little resistance is not a disguised form interface Pad paste mixture structure can not be directly connected to the device heat sink, must clip or other mechanical fasteners to maintain the heat sink to the device's clamping pressure. 

 Features and Benefits 
 Program has been confirmed - PC manufacturer products in use over several years; reliability has been confirmed - the 3000 temperature cycles with no loss or air-dry; can provide customers feel cut shape (cut in light volume) 
 52 ℃ or 58 ℃ phase transition temperature; operating temperature of the thixotropic (lake-like viscosity) Performance Guarantee when used in the vertical direction or material will not be extended under the drop; not conductive. 

 Typical applications 
 Microprocessor memory modules DC / DC converter power module IGBT component